Thermal analysis is crucial in three-dimensional integrated circuit (3D-IC)
design due to increased power density and complex heat dissipation paths.
Although operator learning frameworks such as DeepOHeat have demonstrated
promising preliminary results in accelerating thermal simulation, they face
critical limitations in prediction capability for multi-scale thermal patterns,
training efficiency, and trustworthiness of results during design optimization.
This paper presents DeepOHeat-v1, an enhanced physics-informed operator
learning framework that addresses these challenges through three key
innovations. First, we integrate Kolmogorov-Arnold Networks with learnable
activation functions as trunk networks, enabling an adaptive representation of
multi-scale thermal patterns. This approach achieves a
1.25× and
6.29× reduction in error in two representative test cases. Second, we
introduce a separable training method that decomposes the basis function along
the coordinate axes, achieving
62× training speedup and
31× GPU
memory reduction in our baseline case, and enabling thermal analysis at
resolutions previously infeasible due to GPU memory constraints. Third, we
propose a confidence score to evaluate the trustworthiness of the predicted
results, and further develop a hybrid optimization workflow that combines
operator learning with finite difference (FD) using Generalized Minimal
Residual (GMRES) method for incremental solution refinement, enabling efficient
and trustworthy thermal optimization. Experimental results demonstrate that
DeepOHeat-v1 achieves accuracy comparable to optimization using high-fidelity
finite difference solvers, while speeding up the entire optimization process by
70.6× in our test cases, effectively minimizing the peak temperature
through optimal placement of heat-generating components.